Nanolithography.  
		The Electron Beam Lithography Facility at the Institute for Electronics and Nanotechnology
		of the Georgia Institute of Technology.
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    Ellipsometry can be used to obtain index of refraction, absorption, and thickness of a thin film.

      substrate = 4" silicon wafer
      resist = 950k MW PMMA A4
      spin
      static puddle dispense
      5000 RPM, 2000 RPM/s, 60sec
      180 C hotplate bake, 90 sec

      thickness = 150.45nm +/- 0.0127
      MSE = 1.567

      Cauchy
      A = 1.4783
      B = 0.0031969
      C = 0.00024606

      Index of refraction table
      nm n
      400 1.5079
      410 1.506
      420 1.5043
      430 1.5028
      440 1.5014
      450 1.5001
      460 1.4989
      470 1.4978
      480 1.4968
      490 1.4959
      500 1.495
      510 1.4942
      520 1.4935
      530 1.4928
      540 1.4922
      550 1.4916
      560 1.491
      570 1.4905
      580 1.49
      590 1.4895
      600 1.4891
      610 1.4887
      620 1.4883
      630 1.4879
      640 1.4876
      650 1.4872
      660 1.4869
      670 1.4866
      680 1.4864
      690 1.4861
      700 1.4858
      710 1.4856
      720 1.4854
      730 1.4852
      740 1.485
      750 1.4848
      760 1.4846
      770 1.4844
      780 1.4842
      790 1.4841
      800 1.4839
      810 1.4837
      820 1.4836
      830 1.4835
      840 1.4833
      850 1.4832
      860 1.4831
      870 1.483
      880 1.4828
      890 1.4827
      900 1.4826
      910 1.4825
      920 1.4824
      930 1.4823
      940 1.4822
      950 1.4821
      960 1.4821
      970 1.482
      980 1.4819
      990 1.4818
      1000 1.4817
      1010 1.4817
      1020 1.4816
      1030 1.4815
      1040 1.4815
      1050 1.4814
      1060 1.4813
      1070 1.4813
      1080 1.4812
      1090 1.4812
      1100 1.4811
Electron Beam Lithography Facility
Institute for Electronics and Nanotechnology
Georgia Institute of Technology